Diaphanum princeps borosilicatis temperari vitrum cum munio pertusum
Features
- 3.3 coefficiens scelerisque expansion
- High Temperatus Resistance cum egetstabilitas
-Super Scratch resistant & IMPERVIUS & flamma repugnant
-Perfectum plane et lenitate
-Diebus Delivery Date Assurance
-Unum unum consulationem et professional ductu
-Figura, Size, FIGS & Design potest nativus ut petitionem
-Anti-Glare / Anti-reflective / Anti-Fingerprint / Anti-Microbial es available hic
AltumBorosilicate vitrumMaterial Datasheet
| 密度 (density) | 2.30G / C² |
| 硬度 (Mohs durum) | 6.0Mohs ` |
| 弹性模量 (Elasticity modulus) | 67Knmm - II |
| 抗张强度 (tensile vires) | XL - 120nmm - II |
| 泊松比 (Poisson Ratio) | 0.18 |
| 热膨胀系数 (20-400 ° C), (coefficientem scelerisque expansion) | (3.3) * 6, VI |
| 导热率比热 (XC ° F) (specifica æstus conductivity) | 1.2w * (M * k`-I) |
| 折射率 (refractive index) | 1.6375 |
| 比热 (specifica calor), (J / kg) | DCCCXXX |
| 熔点 (Melting Point) | MCCCXX ° C |
| 软化点 (softing punctum) | DCCCXV ° C |
| 连续工作温度 / 使用寿命 (continua operating temperatus / Service Vita) | CL ° C |
| ≥120000H (-60 ° C, CL ° F) | CC ° C |
| ≥90000h (-60 ° C, CC ° F) | CCLXXX ° C |
| ≥620000h (-60 ° C CCLXXX ° F) | CCCLXX ° C |
| ≥30000h | DXX ° C |
| ≥130000h | |
| 抗热冲击 (Thermal Mass) | ≤350 ° C |
| 抗冲击强度 (Impact vires) | ≥7j |
| 主要化学成分% 含量 (pelagus chemica compositionem% content) | |
| Sio2 | 80.40% |
| Fe203 | 0.02% |
| Ti02 | 1.00% |
| B203 | 12.50% |
| NA20 + K20 | 4.20% |
| FE | 0.02% |
| 耐水性 (aqua tolerantia) | HGB I 级 (HGB I) |
QuidBorosilicate vitrum?
Borosilicate vitrum est genus speculum cum silica et boron trioxide ut pelagus speculum, formatam constituunt. Borosilicate specula notum est habens humilis coefficientes de scelerisque expansion (≈3 × 10⁻⁶ k⁻⁻ ad XX ° C), faciens ea magis resistens ad scelerisque inpulsa quam alia commune vitrum. Tantum vitrum subiecta est minus scelerisque accentus et potest sustinere temperatus differentialia sine fracturing de CLXV ° C (CCXCVII F). Hoc est communiter propter constructionem Reagent utres et lelans tum lucendi, electronics et cookware.
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Omnes materiae usus est Obsequium cum Radii III (Europae Version), Rohs II (Sina version), pervenire (Current Version)
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