Itekhnoloji eNtsha yokusika - iLaser Die Cutting

Enye yeglasi yethu encinci ecocekileyo epholileyo iphantsi kwemveliso, esebenzisa itekhnoloji entsha-Laser Die Cutting.

Yeyona ndlela iphakamileyo yesantya sokwenziwa kwemveliso yomthengi efuna kuphela ukuhlelwa okugudileyo kubungakanani obuncinci beglasi eqiniweyo.

Imveliso yemveliso yi-20pcs ngaphakathi kwemizuzu eyi-1 yale mveliso ngokunyamezela ngokuchanekileyo +/-0.1mm.

Ke, yintoni i-laser die cut for glass?

I-laser kukukhanya okufana nokunye ukukhanya kwendalo kudityaniswe kukutsiba kweeathom (iathom okanye ii-ion, njl.). Kodwa yahlukile ekukhanyeni okuqhelekileyo kuxhomekeke kwimitha ezenzekelayo ngexesha elifutshane kakhulu. Emva koko, inkqubo igqitywe ngokupheleleyo yimitha, ngoko ke i-laser inombala ococekileyo kakhulu, phantse akukho mkhombandlela wokuhlukana, ukukhanya okukhanyayo okuphezulu, ukusebenzisana okuphezulu, ubukhulu obuphezulu kunye neempawu eziphezulu.

Ukusika i-laser ngumqa we-laser ophuma kwijenereyitha ye-laser, ngenkqubo yesekethe yangaphandle, igxile kumandla aphezulu oxinaniso lweemeko zokukhanya kwe-laser, ubushushu be-laser bufunxwa yimathiriyeli ye-workpiece, iqondo lobushushu le-workpiece lenyuka kabukhali, lafikelela kwindawo yokubila. , izinto zaqala ukuba ngumphunga kwaye zenze imingxunya, kunye ne-boam kunye ne-workpiece ehambelana nesimo sokuhamba, kwaye ekugqibeleni wenze ifom yezinto eziphathekayo. Iiparamitha zenkqubo (isantya sokusika, amandla e-laser, uxinzelelo lwegesi, njl.) kunye ne-trajectory yokuhamba ilawulwa yinkqubo yokulawula amanani, kwaye i-slag kwi-seam yokusika ikhutshwe yigesi encedisayo kwixinzelelo oluthile.