Ubuchwepheshe obusha bokusika - i-Laser Die Cutting

Enye yengilazi yethu ecwebile eyenziwe ngokwezifiso ingaphansi kokukhiqizwa, esebenzisa ubuchwepheshe obusha - i-Laser Die Cutting.

Kuyindlela ephezulu kakhulu yokucubungula ukuphuma kwesivinini yekhasimende elifuna kuphela ukuhleleka okubushelelezi ngosayizi omncane kakhulu wengilazi eqinisiwe.

Okukhiphayo kokukhiqiza kungu-20pcs ngaphakathi kweminithi elingu-1 kulo mkhiqizo ngokubekezelela ngokunemba +/-0.1mm.

Ngakho-ke, yini i-laser die cut for glass?

I-laser ukukhanya okufana nokunye ukukhanya kwemvelo kuhlanganiswe ukweqa kwama-athomu (ama-molecule noma ama-ion, njll.).Kodwa kuhlukile ekukhanyeni okuvamile kuncike emisebeni ezenzakalelayo ngesikhathi sokuqala esifushane kakhulu.Ngemva kwalokho, inqubo inqunywa ngokuphelele ngemisebe, ngakho-ke i-laser inombala omsulwa kakhulu, cishe akukho ukuhlukana kwesiqondiso, ukuqina okukhanyayo okuphezulu kakhulu, ukusebenzisana okuphezulu, ukuqina okuphezulu nezici zokuqondisa okuphezulu.

Ukusika kwe-laser ugongolo lwe-laser oluphuma kujeneretha ye-laser, ngohlelo lwesekethe lwangaphandle, lugxile ekuqineni okukhulu kwamandla ezimo zokushiswa kwe-laser, ukushisa kwe-laser kudonswa yi-workpiece material, izinga lokushisa le-workpiece lenyuka kakhulu, lafinyelela iphuzu elibilayo. , izinto zaqala ukuhwamuka futhi zakha izimbobo, nge-beam kanye ne-workpiece ehlobene nesimo sokunyakaza, futhi ekugcineni yenze ifomu lokusika.Imingcele yenqubo (ijubane lokusika, amandla e-laser, ingcindezi yegesi, njll.) kanye ne-trajectory yokunyakaza kulawulwa uhlelo lokulawula izinombolo, futhi i-slag emgqeni wokusika ishaywa yigesi elisizayo ngokucindezela okuthile.